Datasheet

Modules Overview

The SNAP Engine Model SM200 series includes the SM200P81 and SM200PU1 part numbers. They are IEEE 802.15.4, low-power, highly reliable solutions to embedded wireless control and monitoring network needs that require high data rates. The Model SM200 embeds Synapse’s SNAP OS, the industry’s first Internet-enabled, wireless mesh network operating system into the Atmel ATmega128RFA1 single-chip AVR® microcontroller with an integrated transceiver that delivers up to 2Mbits/sec. These low-cost modules can have current consumption as low as 0.37 µA to enable a new generation of battery-driven systems.

SNAP’s on-board Python interpreter provides for rapid application development and over-the-air programming, while Atmel’s low-power RF single-chip design saves board space and lowers the overall Bill of Materials and power consumption. The Model SM200 modules are approved as an FCC Part 15 unlicensed modular transmitters, as well as having CE Certification and IC Certification. The modules provide up to 16 channels of operation in the ISM 2.4GHz frequency band.

By default, the SNAP operating system automatically forms a mesh network with other nodes immediately on receiving power. No further configuration is necessary. Multiple unrelated SNAP networks can exist within the same area through several configuration options outlined in the SNAP User Guide.

Datasheet covers Part Numbers SM200P81 and SM200PU1:

  • 34 GPIO with up to 7 A/D inputs

  • 128k flash, 58.5k free for over-the-air uploaded user apps

  • Two UART ports for control or transparent data

  • Low power modes:
    • 0.37 µA with external interrupt

    • 1.37 µA with internal timer running

  • Spread Spectrum (DSSS) technology

  • Up to 2 Mbps radio data rate

  • 2.4 GHz RF Frequency

  • AES 128-bit encryption

  • Integrated chip antenna or U.FL connecter

  • Surface Mount, Solder-able

  • 4K internal EEPROM

  • 8 PWM outputs

The SM200 is also available with a U.FL connector. Contact Synapse for details.

Specifications

Table 2.1: SM200 Specifications at 25° C and 3.3V unless otherwise noted

Performance

Outdoor LOS Range

Up to 1500/2500 feet at 250Kbps

Transmit Power Output

3 dBm

RF Data Rate

250Kbps, 500Kbps, 1Mbps, 2Mbps

Receiver Sensitivity

-100 dBm (1% PER, 250Kbps)

Power Requirements

Supply Voltage

2.0 - 3.6 V

Transmit Current (Typ@3.3V)

22.5 mA

Idle/Receive Current (Typ@3.3V)

20.5 mA

Power-down Current (Typ@3.3V)

0.37 µA

General

Frequency

ISM 2.4 GHz

Spreading Method

Direct Sequence (DSSS)

Modulation

O-QPSK

Dimensions

29.8mm x 19mm

Operating Temperature

-40 to 85 deg C.

Antenna Options

Integrated Chip Antenna / External Antenna

Networking

Topology

SNAP

Error Handling

Retries and acknowledgement

Number of Channels

16

Available I/O

UARTS with HW Flow Control

2 Ports

GPIO

34 total; 7 can be analog-in with 10bit ADC

Agency Approvals

FCC Part 15.247

FCC ID: U9O-SM200

Industry Canada (IC)

IC: 7084A-SM200

CE Certified

Certified to EN 300 328 Version 2.2.2

International Conformity Marks

CE and UKCA

You must preserve access to UART1 as a serial connection in order to be able to update firmware on the node, or to recover the node by forced script removal or parameter reset.

Module Pin Definitions

For pin locations, consult the SM200 Mechanical drawing later in this document.

Table 3.1: SM200PF1/PU1 Pin Assignments

SM200 Pin

SNAPpy IO

Pin Name

Pin Description

A1

GND

Power Supply

A2

VCC

Power Supply

A3

VCC

Power Supply

A4

24

PF0_ADC0

IO or Analog0

A5

26

PF2_ADC2_DIG2

IO or Analog2 or SPI CLK

A6

28

PF4_ADC4_TCK

IO or Analog4 or JTAG Test Clock

A7

30

PF6_ADC6_TDO

IO or Analog6 or JTAG Test Data Out or I2C SDA

A8

GND

Power Supply

B1

18

PE2_XCK0_AIN0

IO or software SPI1 MISO or Analog Comparator or External Clock

B2

19

PE3_OC3A_AIN1

IO or Analog Comparator or PWM or Output Compare Match

B3

21

PE5_OC3C_INT5

IO or UART0 RTS Input or PWM or Interrupt

B4

25

PF1_ADC1

IO or Analog1 or software SPI MOSI

B5

33

PG1_DIG1

IO

B6

29

PF5_ADC5_TMS

IO or Analog5 or JTAG Test Mode Select

B7

31

PF7_ADC7_TDI

IO or Analog7 or JTAG Test Data In or software I2C SCL

B8

GND

Power Supply

C1

16

PE0_RXD0_PCINT8

IO or UART0 Data In or Interrupt

C2

17

PE1_TXD0

IO or UART0 Data Out

C3

20

PE4_OC3B_INT4

IO or UART0 CTS Output or PWM or Interrupt

C4

22

PE6_T3_INT6

IO or Interrupt

C5

23

PE7_ICP3_INT7_CLK 0

IO or UART1 RTS input or Clock Output Buffer or Interrupt

C6

27

PF3_ADC3_DIG4

IO or ADC channel 3

C7

NC

C8

GND

Power Supply

D1

5

PB5_OC1A_PCINT5

IO or PWM or Interrupt

D2

6

PB6_OC1B_PCINT6

IO or PWM or Interrupt

D3

7

PB7_OC0A_OC1C_P CINT7

IO or PWM or Interrupt

D4

NC

D5

NC

D6

NC

D7

NC

D8

GND

Power Supply

E1

2

PB2_MOSI_PCINT21

IO or Interrupt

E2

3

PB3_MISO_PCINT31

IO or Interrupt

E3

4

PB4_OC2A_PCINT4

IO or PWM or Interrupt

E4

NC

E5

NC

E6

NC

E7

NC

E8

NC

F1

0

PB0_SSN_PCINT01

IO or Interrupt

F2

1

PB1_SCK_PCINT11

IO or Interrupt

F3

9

PD1_SDA_INT11

IO or Interrupt

F4

8

PD0_SCL_INT01

IO or Interrupt

F5

NC

F6

NC

F7

NC

F8

GND

Power Supply

G1

NC

G2

15

PD7_T0

IO

G3

12

PD4_ICP1

IO or UART1 CTS output or Input Capture

G4

10

PD2_RXD1_INT2

IO or UART1 Data In or Interrupt

G5

37

PG5_OC0B

IO or PWM

G6

NC

G7

NC

G8

GND

Power Supply

H1

GND

Power Supply

H2

14

PD6_T1

IO or Timer/Counter1 clock input

H3

13

PD5_XCK1

IO

H4

11

PD3_TXD1_INT3

IO or UART1 Data Out or Interrupt

H5

RESET#

Module Reset, Active Low

H6

NC

H7

NC

H8

GND

Power Supply

1These pins have special I2C and/or SPI hardware that is not natively supported by SNAP. You could use peek and poke to initialize and enable this hardware functionality, but it is not supported by Synapse and we cannot guarantee your results.

Table 3.2: SM200/SNAPpy IO Cross Reference

Pad

SNAPpy IO

A4

24

A5

26

A6

28

A7

30

B1

18

B2

19

B3

21

B4

25

B5

33

B6

29

B7

31

C1

16

C2

17

C3

20

C4

22

C5

23

C6

27

D1

5

D2

6

D3

7

E1

2

E2

3

E3

4

F1

0

F2

1

F3

9

F4

8

G2

15

G3

12

G4

10

G5

37

H2

14

H3

13

H4

11

Electrical Characteristics

Table 4.1: SM200 DC Characteristics at 25° C

Symbol

Parameter

Condition

Min

Typ

Max

Units

VCC1

Supply Voltage

2.0

3.3

3.6

V

TOP

Operating Temp

-40

85

°C

TSTOR

Storage Temp

-40

125

°C

VIH

Input Hi Voltage

All Digital Inputs

0.7 VCC

V

VIL

Input Low Voltage

All Digital Inputs

0.3 VCC

V

VOL

Output Low Voltage

All drive strengths (2,4,6,8 mA)

0.4

V

VOH

Output High Voltage

All drive strengths (2,4,6,8 mA)

VCC- 0.4

V

ILIN

In Leakage Current

VIN= VCCor VSS, all Pins

<10nA

1

µA

TX-ICC

Transmit Current - Transceiver only

VCC= 3.3V PTX=3dBm

14.5

mA

Transmit Current - Transceiver and CPU

22.5

mA

RX-ICC

Receive Current - Transceiver only

VCC= 3.3V

12.5

mA

Receive Current - Transceiver and CPU

20.5

mA

SHDN- ICC

VCC= 3.3V

0.37

µA

1Absolute maximum stress rated voltage for VCC is -0.3 to 3.6. It is recommended that bulk capacitance be located as close as possible to the VCC pin on the host board. Ideally, use a single 47µF capacitor at 10V directly at the VCC pin.

Table 4.2: ADC Electrical Characteristics (Operating)

VREFH1

ADC Voltage Reference, High

Programmable

1.5

1.6

1.8

V

VINDC

Analog input voltage

Single Ended

0

1.8

V

Differential2

0

3.3

V

Table 4.3: ADC Timing/Performance Characteristics

Symbol

Parameter

Condition

Min

Typical

Max

Unit

RAS

Source impedance at input1

3k

RES

Conversion Resolution

Single Ended CLKADC <= 4MHz

10

Bits

DNL

Differential non- linearity

VREFH = 1.6V CLKADC=4MHz

-0.5

LSB

INL

Integral non- linearity

VREFH = 1.6V CLKADC=4MHz

0.8

LSB

EZS

Zero-scale error

1.5

LSB

EG

Gain error

1

LSB

1Any analog source with a source impedance greater than 3kΩ will increase the sampling time.

Table 4.4: Reset, Brown-out and Internal Voltage Characteristics

Symbol

Parameter

Condition

Min

Typical

Max

Unit

VPOT (rising)

Power-on Reset Threshold Voltage (rising)

Power supply fully discharged

1.6

V

VPOT (falling)

Power-on Reset Threshold Voltage (falling)

0.05

0.3

V

tPOT

Power-on Reset recovery time

Time of EVDD/DEVDD < VPOT

1

ms

VPSR

Power-on slope rate

1.8

3300

V/ms

VRST

RSTN Pin Threshold Voltage

0.1VDD

0.9 VDD

V

tRST

Minimum pulse width on RSTN Pin

200

300

ns

VHYS

Brown-out Detector Hysteresis

7.5

50

mV

tBOD

Min Pulse Width on Brown-out Reset

100

ns

Mechanical Drawings

The drawings below show the modules with the option of the integrated chip antenna or U.FL Connector.

Note

The area under the module’s antenna (marked NO COPPER or KEEP OUT AREA) should have no components, no traces, and no copper on any layer of the printed circuit board.

SM200PF1/PU1 Mechanical Drawing

SM200PF1/PU1 Mechanical Drawing

Note

Metric measurements in millimeters are between brackets, with standard measurements in inches below.

SM200 Block Diagram

Block diagram showing the major subsystems comprising Model SM200

Antenna Gain Performance

Note

Antenna gain performance information is based on information from the individual companies at the time this document’s release. For added assurance, it’s best to obtain antenna performance information directly from that antenna’s manufacturer.

SM200 Partron Antenna Gain Performance

Partron SDBTPTR3015 Antenna Gain Performance

SM200 Pulse Antenna Gain Performance

Pulse W1027 Antenna Gain Performance

Board Mounting Considerations

Processing

Table 7.1: Recommended Reflow Profile

Parameter

Value

Ramp up rate (from Tsoakmax to Tpeak)

3°/sec max

Minimum Soak Temperature

150°C

Maximum Soak Temperature

200°C

Soak Time

60-120 sec

TLiquidus

217°C

Time above TL

30-60 sec (recommended: 40 sec)

Tpeak

230° - 250°C (recommended: 235oC)

Time within 5° of Tpeak

20-30 sec

Time from 25° to Tpeak

8 min max

Ramp down rate

6°C/sec max

SM200 Reflow Profile

Pb-Free Soldering Paste

Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process.

Cleaning

In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process.

  • Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads. Water could also damage any stickers or labels.

  • Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two housings, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels.

  • Ultrasonic cleaning could damage the module permanently.

The recommended approach is to consider using a “no clean” soldering paste and eliminate the post-soldering cleaning step.

Repeating Reflow Soldering

Only a single reflow soldering process is encouraged for host boards.

Rework

The Model SM200 Module can be unsoldered from the host board, but the process is likely to damage the chip and not recommended. If attempting this, use of a hot air rework tool and hot plate for pre-heating from underneath is recommended. Avoid overheating.

Warning

Never attempt a rework on the module itself (e.g. replacing individual components). Such actions will terminate warranty coverage.

Additional Grounding

Attempts to improve module or system grounding by soldering braids, wires, or cables onto the module RF shield cover is done at the customer’s own risk. The numerous ground pins at the module perimeter should be sufficient for optimum immunity to external RF interference.

Packaging

Synapse SM series modules are available on plastic reels of carrier tape. The dimensions for those reels are provided below.

SM200 Reel Packaging

H+/-0.5

C1+/-1.0

A+/-0.2

C+0.5 -0.2

T+/-0.3

B+/-0.2

D+/-2.0

44.5

ø330

2.2

13

2.2

10.75

99.5

All dimensions are in mm.

SM200 Carrier Tape Packaging
  1. Sprocket hole pitch cumulative tolerance: +/-0.2mm.

  2. Carrier camber not to exceed 1mm in 250mm.

  3. All dimensions meet EIA-481-C requirements.

  4. Thickness: 0.35mm +/- 0.05mm.

  5. Packing length per reel: 12.6 meters.

  6. Component load per reel: 500 pieces.

Agency Certifications

United States (FCC)

The Model SM200 modules comply with Part 15 of the FCC rules and regulations. Compliance with the labeling requirements, FCC notices, and antenna usage guidelines is required. In order to comply with FCC Certification requirements, the Original Equipment Manufacturer (OEM) must fulfill the following requirements.

  1. The system integrator must place an exterior label on the outside of the final product housing the SM200 Modules. FCC Label below shows the contents that must be included on this label.

  2. SM200 Modules may only be used with the antenna that has been tested and approved for use with the module. Please refer to the antenna table provided in this section.

OEM Labeling Requirements

NOTICE: The OEM must make sure that FCC labeling requirements are met. This includes a clearly visible exterior label on the outside of the final product housing that displays the contents shown in FCC Label below.

SM200 FCC Label

FCC Label

FCC Notices

Warning

The SM200 modules have been tested by the FCC for use with other products without further certification (as per FCC Section 2.1091). Changes or modifications to this device not expressly approved by Synapse Wireless Inc. could void the user’s authority to operate the equipment.

NOTICE: OEM’s must certify final end product to comply with unintentional radiators (FCC Sections 15.107 and 15.109) before declaring compliance of their final product to Part 15 of the FCC Rules.

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.

  • Increase the separation between the equipment and receiver.

  • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

  • Consult the dealer or an experienced radio/TV technician for help.

FCC Approved Antennas

The SM200 modules are FCC-approved for fixed base station, mobile, and portable applications.

NOTICE: To reduce potential radio interference to other users, the antenna type and its gain should be chosen so that the equivalent isotropically radiated power (EIRP) is not more than that permitted for successful communication. This module has been designed to operate with the antennas listed in SM200 Approved FCC Antennas above. The required antenna impedance is 50 ohms.

In order to comply with FCC/ISED RF Exposure requirements, this device must be installed to provide at least 20 cm separation from the human body at all times.

Table 8.1: SM200 Approved FCC Antennas

Part Number

Type

Gain

Application

Min. Separation

Partron SDBTPTR3015

Chip

1.96 dBi

Fixed/Mobile

20 cm.

Table 8.2: SM200 Approved FCC Antennas

Part Number

Type

Gain

Application

Min. Separation

Pulse W1027

Dipole (quarter-wave RPSMA)

3.2 dBi

Fixed/Mobile

20 cm.

For more information on approved antennas, please consult the manufacturer’s website.

Note

Antenna and transmitters may be co-located or operated in conjunction with this device only if the transmitters do not simultaneously transmit. Otherwise, additional regulatory requirements will apply.

Canada (IC)

This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.

Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes : (1) l’appareil ne doit pas produire de brouillage, et (2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement.

Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (EIRP) is not more than that necessary for successful communication.

Conformément à la réglementation d’Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d’un type et d’un gain maximal (ou inférieur) approuvé pour l’émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l’intention des autres utilisateurs, il faut choisir le type d’antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l’intensité nécessaire à l’établissement d’une communication satisfaisante.

This radio transmitter Model: SM200, IC: 7084A-SM200 has been approved by Industry Canada to operate with the antenna types listed below with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.

Le présent émetteur radio Model : SM200, IC : 7084A-SM200 a été approuvé par Industrie Canada pour fonctionner avec les types d’antenne énumérés ci-dessous et ayant un gain admissible maximal et l’impédance requise pour chaque type d’antenne. Les types d’antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l’exploitation de l’émetteur.

In order to comply with FCC/ISED RF Exposure requirements, this device must be installed to provide at least 20 cm separation from the human body at all times.

Afin de se conformer aux exigences d’exposition RF FCC / ISED, cet appareil doit être installé pour fournir au moins 20 cm de séparation du corps humain en tout temps.

Table 8.3: SM200 Approved IC Antennas

Part Number

Type

Gain

Application

Min. Separation

Partron SDBTPTR3015

Chip

1.96 dBi

Fixed/Mobile

20 cm.

Table 8.4: SM200 Approved IC Antennas

Part Number

Type

Gain

Application

Min. Separation

Pulse W1027

Dipole (quarter-wave RPSMA)

3.2 dBi

Fixed/Mobile

20 cm.

CE Approved Antennas

The SM200 modules are CE-approved for fixed base station and mobile applications.

NOTICE: To reduce potential radio interference to other users, the antenna type and its gain should be chosen so that the equivalent isotropically radiated power (EIRP) is not more than that permitted for successful communication. This module has been designed to operate with the antennas listed in SM200 Approved FCC Antennas above. The required antenna impedance is 50 ohms.

In order to comply with FCC/ISED RF Exposure requirements, this device must be installed to provide at least 20 cm separation from the human body at all times.

Table 8.5: SM200 Approved CE Antennas

Part Number

Type

Gain

Application

Min. Separation

Partron SDBTPTR3015

Chip

1.96 dBi

Fixed/Mobile

20 cm.

Table 8.6: SM200 Approved CE Antennas

Part Number

Type

Gain

Application

Min. Separation

Pulse W1027

Dipole (quarter-wave RPSMA)

3.2 dBi

Fixed/Mobile

20 cm.

For more information on approved antennas, please consult the manufacturer’s website.

Note

Antenna and transmitters may be co-located or operated in conjunction with this device only if the transmitters do not simultaneously transmit. Otherwise, additional regulatory requirements will apply.

IC OEM Labeling Requirements

Labeling requirements for Industry Canada are similar to those of the FCC. A clearly visible label on the outside of the final product housing must display the contents shown in IC Label below.

SM200 IC Label

IC Label

Note

The OEM can choose to implement a single label combined for both FCC and IC labeling requirements. If a combined single label is chosen, there must be a clearly visible label on the outside of the final product housing displaying the contents shown in Combined FCC and IC Label below.

SM200 Combined FCC and IC Label

Combined FCC and IC Label

OEM Labeling Requirements for the European Union

SM200 CE Logo

The “CE” mark must be placed on the OEM product in a visible location. The CE mark will consist of the Initials “CE” with the following form:

If the CE marking is reduced or enlarged, the proportions given in the following drawing must be adhered too.

The CE mark must be a minimum of 5mm in height.

The CE marking must be affixed visibly, legibly, and indelibly.

Since the 2400-2483.5 MHz band is not harmonized by a few countries throughout Europe, the Restriction sign must be placed to the right of the CE marking as shown in the drawing.

Note

The OEM can choose to implement a single label combined for FCC, CE and IC labeling requirements. If a combined single label is chosen, there must be a clearly visible label on the outside of the final product housing displaying the contents shown in Combined FCC, CE and IC Label above.

SM200 Combined FCC, CE and IC Label

Combined FCC, CE and IC Label